Day-to-Day Responsibilities
Set up and run the coater/developer track systems and the exposure scanners or steppers that process wafers
Tune process settings such as prebake temperature, photoresist thickness, exposure dose and post-exposure bake
Monitor pattern measurements such as critical dimension and overlay, and check that they stay within tolerance
Investigate defects and pattern failures, find the root cause and agree on a fix with the team
Work with mask (reticle) design and alignment teams so the pattern on the mask matches the chip design
Coordinate with etch, deposition and implant teams, since the patterned resist guides every step that follows
Follow strict cleanroom, chemical and safety protocols, and document every process change


