Day-to-Day Responsibilities
Design package structures and layouts, such as leadframe, substrate or stacked-die packages, with the chip design team.
Choose packaging materials and assembly methods, such as die attach, wire bonding or flip-chip, to suit a chip's electrical, thermal and size needs.
Run process trials and optimise assembly steps like die attach, bonding, moulding and sealing.
Plan and review test and metrology steps that check package quality, especially for 3D-IC and stacked designs.
Analyse failures from reliability tests such as thermal cycling and moisture tests, and recommend fixes.
Work with yield, quality and reliability teams to meet customer and industry standards.
Document process recipes, track changes and prepare reports for production and customers.


