Day-to-Day Responsibilities
Designing transistor structures and device layouts, and checking them with TCAD and other simulation tools before any wafer is processed.
Developing and tuning fabrication steps such as thin-film deposition, lithography, etching, doping and annealing in a cleanroom.
Running process experiments and measuring results with tools such as scanning electron microscopes, atomic force microscopes and electrical probe stations.
Analysing yield and failure data to find why wafers or chips fall outside specification, and proposing fixes.
Working with circuit design, materials and manufacturing teams so that the fabricated device matches what the chip needs.
Recording process recipes and following strict cleanroom, chemical handling and safety protocols.
Reading research on newer materials and device architectures, such as 2D materials, high-k dielectrics and FinFET or gate-all-around transistors, and testing what is relevant.


