Day-to-Day Responsibilities
Design the end-to-end process flow that sequences steps such as oxidation, lithography, etching, deposition, implantation and CMP.
Work with module process engineers to set the recipe targets and tolerances each step must meet.
Plan and run design of experiments (DOE) on wafers to tune the flow and reduce yield loss.
Track yield, defect and parametric data using statistical process control and find root causes.
Coordinate with equipment, device and test teams when a change in one step affects another.
Qualify and document process changes before they move into volume production.
Lead problem-solving reviews during fab excursions, shift issues and customer quality escapes.


