Day-to-Day Responsibilities
Design the package for a qubit chip, including the carrier, chip holder, interposer and the routing that carries signals in and out.
Select materials that stay stable at millikelvin temperatures and match the chip's thermal expansion, so bonds do not crack when cooled.
Plan shielding against stray magnetic fields, infrared heat and radio-frequency noise that can disturb qubits.
Run thermal, electromagnetic and mechanical simulations before any hardware is built.
Oversee wire bonding, flip-chip bonding and die attach in cleanroom or controlled assembly lines.
Test assembled packages in dilution refrigerators and cryostats, and record yield and failure data.
Work with chip designers and the fabrication team to fix mismatches between the chip and its package, and document each change.
