Day-to-Day Responsibilities
Review inspection and test data from wafer fabrication, probe testing and final testing to spot results that fall outside specification.
Run root cause analysis on defects and failed devices, using tools such as Pareto charts, fishbone diagrams and 8D reports.
Monitor statistical process control (SPC) charts and flag shifts early, before they cause scrap or yield loss.
Check measurement and inspection steps with metrology teams to confirm that results can be trusted.
Audit processes and documents against quality management systems such as ISO 9001 and customer-specific requirements.
Coordinate with process, equipment and test engineers to agree corrective and preventive actions, then confirm they work.
Check incoming wafers, substrates, chemicals and packaging materials against supplier specifications.
Prepare reliability and qualification reports, and respond to customer quality queries and returned-device analysis.


