Day-to-Day Responsibilities
Plan and run reliability tests such as high-temperature, voltage and humidity stress tests on chips and packages.
Analyse failed devices from test lines and customer returns to find the root cause of each failure.
Use failure analysis tools and electrical test data to separate design faults from process faults.
Study how crystal faults such as dislocations and stacking faults can make semiconductor devices defective.
Track failure rates and reliability data over time and report the results to design and production teams.
Work with design engineers to suggest circuit or layout changes that improve how long a device lasts.
Work with process and yield teams on fab steps such as oxidation, etching and doping that affect device life, and document qualification results against customer and industry standards.


